Enabling Robust Wired Condition-Based Monitoring for Industry 4.0—Part 2

In the first part of this article, “Enabling Robust Wired Condition-Based Monitoring for Industry 4.0—Part 1,” we presented Analog Devices’ wired interface solutions, which reduce customer design cycle and test time, and enable faster time to market for industrial CbM solutions. This article (Part 2 of 2) focuses on detailed physical layer design considerations for the SPI to RS-485/RS-422 design solutions presented in Part 1.