Achieving Higher-Density Code Storage with Serial Flash Memory

Serial NOR flash remains an attractive market for code storage and, for densities up to 256Mb, will continue to be strong for many years to come. Today, these parts are being manufactured in high volume at 6x and 5x nm technologies.

However, NOR flash has reached its technology limit and becomes very expensive when shrunk at 4x nm technology and beyond. Flash memory requirements at higher densities for applications like automotive, industrial, IoT, networking and mobile is exploding. As the code size continues to increase for these and other applications from 512Mb density and beyond, the solution is Serial SLC NAND flash based on the SPI interface, offering a better cost per bit with significant compatibility to serial NOR.

Designers can easily migrate from serial NOR to serial NAND for their code storage requirements providing minimal impact to their system design. To add further flexibility in density, a new manufacturing capability is now available whereby serial NOR and serial NAND dies are stacked together in a single package. Additional capability for code storage is also available with security features built in with the serial flash to provide security flash products.

Attendees of this session will come away with a far better understanding of the direction code-storage serial flash is taking.

Speaker

  • Krishna Shekar, Sr. Director of Strategic Marketing
    Mr. Shekar is responsible for Marketing, technical and product support of Serial Flash, NAND Flash Memory and multi-chip package solutions. He has supported the memory industry for the past 25 years in marketing and application positions. He holds a Bachelor’s degree in Electrical Engineering from Bangalore University and a Master’s degree in Electrical Engineering from Kansas State University.
    Mr. Shekar was previously employed at Macronix America Inc. where he held the title of Director of Strategic Marketing before joining Winbond in 2009.


 


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