Which DBC/AMB substrate surface properties are critical for my application?

The surface properties of Direct Bonded Copper and Active Metal Brazed substrates are very important for the production of power modules. Assembly processes like soldering, sintering, gluing, ultrasonic bonding and welding are used to join semiconductors, wires, baseplate and many other components with the substrates. These assembly processes not only are critical to achieve the best possible thermal and electrical performance. They also play a significant role to fulfill the requirements regarding reliability.

As a consequence power module manufacturers should give special care to the specification of the surface of the substrates. This webinar will highlight the importance and the influence of copper grain size, surface roughness, surface cleanliness and surface finish on the assembly process. Typical values, test and measurement methods and some best practices will be provided.

Date/Time

  • September 24th, 2018
  • 15h00 CEST/ Berlin time (09h00 EDT/ New York time)

Speaker

  • Olivier Mathieu, Product Innovation Manager | Power Electronics Solutions


 


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June 2018

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