Reliability of metallized ceramic substrates for power electronics application

As a design engineer for power electronics systems, you require the selected power module to fulfill its electrical function as described in its data sheet and you expect this module to be reliable meaning that it should operate under given conditions, in a defined period of time and within an acceptable failure rate.

While solder fatigue and wire lift offs have been the main limiting factors for the lifetime of conventional modules, new technologies for assembly and packaging of semiconductors have emerged and new module generations achieve much longer lifetime.

Looking forward, metallized ceramic substrates will remain key components in the modules to guarantee their functionality and reliability. This webinar will provide you some guidance for the selection of the most reliable material combination and design of the substrates.
 

Speaker

  • Olivier Mathieu, Product Innovation Manager for Power Electronics Solutions with Rogers Corporation


 


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