Why reliable, Industrial temperature memory device is crucial in IIoT and the realms of Connected World

In the coming years, tens of billions of IoT device will be connected and generate massively intertwined data collected from sensors, devices through the IIoT (Industrial Internet of Things) applications.

Industrial IoT device and applications will strive for more cloud memory data storage solutions that will enable us to build and live in a better, connected World. However, not every piece of data operating under IIoT will be uploaded to the cloud; instead, a good portion of IoT memory data will be stored, processed and analyzed at the center of edge computing, which inevitably, demands edge to act quicker with higher data reflex and reliability. The challenge is that edge computing typically operates in remote areas that are exposed to extreme H/L temperatures in harsh environmental conditions.

To overcome 'bad weather,' and for stored IoT memory in edge to stay functional under extreme H/L temperature variations, ATP Electronics has successfully developed a new (Industrial Temperature) iTemp MLC solution, best suited for IIoT/ industrial applications.

The new iTemp MLC solution strikes a great balance between cost as well as placing memory reliability as its priority; by conducting strict iTemp validation testing technologies in both IC / NAND Flash level screening process and H/L temperature test to ensure that MLC type NAND Flash reliability is uncompromised in sand or snow environments (-40°C~+85°C).

Is your 'Reliability' iTemp storage really up to the task in harsh H/L temperature environments?

There is a common misconception that by, simply using ready-made industrial-rated components, the iTemp storage is then able to reliably operate in extreme H/L temperatures, where in fact, there's more parameters to cover.

The parameters that affect reliability - NAND characteristics and temperature influence.

As lithographies shrink, there is significant impact on NAND Flash quality. Smaller lithography manufacturing processes tend to raise the numbers in defective parts, which in result equates to uneven manufacturing quality of ICs/NAND flash per module. Also, as manufacturing process matures, data reliability, RBER (Raw Bit Error Rate) and ELFR (Early Life Failure Rate) is also heavily impacted; fewer electrons stored per memory cell can lead to an increase in the number of bit errors, which decreases data retention, as well as its endurance.

In addition, NAND flash reliability is also heavily influenced by the variations in temperature; the variation in temperature causes the changes of the charge distribution in NAND flash, which might cause ill-effects like data retention decreases and to make matters worse, data loss.

Efficient testing mechanism can dramatically reduce influences that negatively impact reliability.

With years of experienced in NAND flash technology/application and physical characteristics of the NAND understanding, ATP Electronics’s iTemp MLC solution has adopted strict validations to support customers’ high product reliability and long-term PLC (product life cycle) requirements in demanding temperatures.

IC Level Test for proper ECC criteria setting. Adopt NAND Flash IC test to verify how ECC and H/L temperature influences the P/E endurance, data retention and operating life of NAND flash. Different levels of ECC bits/1KB setting is tested across varied temperatures to find out the best suited ECC criteria for further RDT reference.

Product Level RDT (Reliability Demonstration Test) for reliability enhancement. Based on the features of NAND instead of pure brute force copy compare, ATP has executed intelligent product level RDT process factoring in H/L temperatures for product quality assurance. By pre-referencing stringent of ECC criteria and adopting stress burn-in test of read/write at temperatures at -40°C and +85°C, ATP's RDT comprehensively tests the whole drive (firmware/user area/spare area included) block by block; weak blocks will then be filtered out and marked as bad blocks condition after the RDT test.

To strengthen memory endurance, ATP double checks the amount of spare blocks in order to make sure that enough valid (good) block remains to replace all failing (over the lifecycle) blocks. Furthermore, not only for NAND flash products, the iTemp MP Level validation test runs across SATA interface as well; a SATA interface testing mechanism is conducted to verify that signal quality is at an optimal level for SATA device running at high speed.

In conclusion, unlike general testing of NAND IC component, ATP's iTemp (industrial Temperature) MLC solutions passes through a strict, rigid RDT advanced test for the entire storage drives (IC/NAND Flash/signal of SATA interface); by stressing H/L temperatures as accelerate factored to reduce the infant mortality and sort out flaws which delivers enhanced reliability and prolonged product lifespans.  ATP's iTemp (industrial Temperature) MLC solutions are capable of fulfilling the demands of extreme IIoT/field applications and achieve the best total cost ownership (TCO) for users to build a better, connected World.



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